Skip navigation

Adhesives

Due to the manifold advantages of the joining process adhesive bonding, it is impossible to imagine everyday life without adhesives. With their numerous applications in a wide variety of industries, they have become virtually indispensable for today's modern life. Many products would not be possible in their present form without adhesives. TITK is a competent partner in the analysis, development and modification of adhesives.

Development and modification of hot melt and pressure sensitive adhesive systems

  • on the basis of EVA, PO, SBC
  • based on PLA, PBS, PCL, PHA (biobased and/or biodegradable)

Development and modification of epoxy resin systems

  • thermally conductive, electrically conductive, flexibilizing, etc.
  • different viscosities, thixotropy

Other adhesive systems on request

  • solvent adhesives
  • water-based dispersion adhesives
  • other reactive adhesives: PUR, acrylates
Analysis of the processability of bio-based adhesive systems
Analysis of the processability of bio-based adhesive systemse

Technical equipment

Analytics

  • Rheometry (plate/plate, cone/plate rheometer): viscosity, loss factor, etc.
  • Thermal analysis (DSC, TGA): transition temperatures, degree of crystallization, kinetics, filler content, etc.
  • Thermomechanical analysis (DMA): glass transition temperature, viscoelastic material properties
  • Mechanical testing (universal testing machine): tensile shear strength, peel test, bending properties
  • Weathering resistance (xenon test chamber): resistance at elevated temperature, humidity, solar radiation 
  • Chemical resistance: acids, bases, solvents, etc.
  • Surface analyses (FTIR, AFM, SEM): material, structural
  • Material properties: Density, pH, hardness, etc.

Laboratory scale

  • Twin-screw extruder
  • Melt agitator: for formulating hotmelt and pressure sensitive adhesives
  • Vacuum dissolver: for formulating highly viscous or highly filled adhesives, such as epoxy resins
  • Laboratory reactor: for formulating low-viscosity adhesives, such as solventborne and dispersion adhesives

Pilot plant scale

  • Twin screw extruder
  • Counterpressure pelletizing, also for particle foam
  • 1 l, 5 l and 20 l stainless steel pressure reactors
  • Pressures up to 20 bar, temperatures up to 250°C
  • Variable agitator geometries for different adhesive types
  • Hotmelt adhesive laminating system: two-layer bonding from roll to roll via slot die coating